Image sensor including cmos image sensor pixel and dynamic vision sensor pixel

ABSTRACT

An image sensor includes a CIS (CMOS image sensor) pixel, a DVS (dynamic vision sensor) pixel, and an image signal processor. The CIS pixel includes a photoelectric conversion device generating charges corresponding to an incident light and a readout circuit generating an output voltage corresponding to the generated charges. The DVS pixel detects a change in an intensity of the incident light based on the generated charges to output an event signal and does not include a separate photoelectric conversion device. The image signal processor allows the photoelectric conversion device to be connected to the readout circuit or the DVS pixel.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of U.S. application Ser. No. 17/492,059 filedOct. 1, 2021, which is a continuation of U.S. application Ser. No.16/552,299 filed Aug. 27, 2019, which claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2018-0107280 filed on Sep. 7,2018, in the Korean Intellectual Property Office and Korean PatentApplication No. 10-2019-0028938 filed on Mar. 13, 2019, in the KoreanIntellectual Property Office, the disclosures of which are incorporatedby reference herein in their entireties.

BACKGROUND

The disclosure relates to an image sensor, and more particularly, to animage sensor including two different kinds of pixels.

Conventional types of image sensors include a complementary metal-oxidesemiconductor (CMOS) image sensor and a dynamic vision sensor. The CMOSimage sensor may be advantageous in that a captured image is provided toa user without modification, but the CMOS image sensor may bedisadvantageous in that the amount of data to be processed is high.Because the dynamic vision sensor detects only an event in which anintensity of light changes and provides output of the detected event,the dynamic vision sensor may be advantageous in that the amount of datato be processed is low, but may be disadvantageous in that a size of thedynamic vision sensor is larger than a size of the CMOS image sensor.

However, both the CMOS image sensor and the dynamic vision sensor mayrequire a photoelectric conversion device for detecting a light. Ingeneral, because photoelectric conversion devices occupy most of thesize of an image sensor, when the CMOS image sensor and the dynamicvision sensor are implemented together in one device, the size of thedevice may increase. Therefore, there is a demand on the architecture ofthe image sensor to reduce the size of the image sensor and decreasingmanufacturing costs of the image sensor.

SUMMARY

Aspects of embodiments of the disclosure provide an architecture for aCMOS image sensor and a dynamic vision sensor sharing a photoelectricconversion device.

Aspects of the embodiments provide an architecture in which the dynamicvision sensor uses photoelectric conversion included in the CMOS imagesensor.

According to an embodiment, an image sensor includes a CIS pixel thatincludes a photoelectric conversion device configured to generatecharges corresponding to an incident light that is incident on the CISpixel and a readout circuit configured to generate an output voltagecorresponding to the charges, a dynamic vision sensor (DVS) pixelconfigured to detect a change in intensity of the incident light basedon the charges generated by the photoelectric conversion device, andoutput an event signal based on the change in intensity, and an imagesignal processor configured to selectively control the image sensor togenerate image data of the image sensor based on the output voltagegenerated by the CIS pixel and generate the image data based on theevent signal generated by the DVS pixel.

According to an embodiment, an image sensor includes a CIS pixel thatincludes a photoelectric conversion device configured to generatecharges corresponding to an incident light that is incident on the CISpixel, a drive transistor, the drive transistor comprising a gateelectrode connected to a floating diffusion node to which the chargesgenerated by the photoelectric conversion device are transferred, and areset transistor configured to reset a voltage of the floating diffusionnode, a dynamic vision sensor (DVS) pixel, the DVS pixel comprising alog current source, the DVS pixel configured to detect a change inintensity of the incident light based on the charges generated by thephotoelectric conversion device, and output an event signal based on thechange in intensity, and an image signal processor configured to connecta gate electrode of the reset transistor and an end of the drivetransistor to the log current source.

According to an embodiment, an image sensor includes a first substratein which a CIS pixel array including a plurality of CMOS image sensor(CIS) pixels is formed, each of the CIS pixels including a photoelectricconversion device configured to generate charges corresponding to anincident light that is incident on the CIS pixel and a readout circuitconfigured to generate an output voltage corresponding to the chargesgenerated by the photoelectric conversion device, a second substrate onwhich a DVS pixel array comprising a plurality of dynamic vision sensor(DVS) pixels is formed, each DVS pixel of the DVS pixel array configuredto detect a change in intensity of the incident light based on thecharges generated by the CIS pixel array to output an event signal basedon the change in intensity, and an image signal processor configured toselectively control the image sensor to generate image data of the imagesensor based on the output voltage and generate the image data based onthe event signal generated by the DVS pixel array.

BRIEF DESCRIPTION OF THE FIGURES

The above and other objects and features of the disclosure will becomeapparent by describing in detail embodiments thereof with reference tothe accompanying drawings, in which:

FIG. 1 illustrates an image sensor according to an embodiment of thedisclosure;

FIG. 2 illustrates a configuration of a CMOS image sensor of FIG. 1 ;

FIG. 3 illustrates a circuit diagram of a configuration of a CIS pixelof FIG. 2 ;

FIG. 4 illustrates a configuration of a dynamic vision sensor of FIG. 1;

FIG. 5 illustrates a circuit diagram of a configuration of a DVS pixelof a DVS pixel array of FIG. 4 ;

FIG. 6 illustrates a configuration of a DVS pixel back-end circuit ofFIG. 5 ;

FIG. 7 illustrates CIS pixels and a DVS pixel sharing the photoelectricconversion device, according to an embodiment of the disclosure;

FIG. 8 illustrates a cross-sectional view of an image sensor accordingto an embodiment of the disclosure;

FIG. 9 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 10 is a diagram illustrating an image sensor of FIG. 9 operating ina first mode;

FIG. 11 is a diagram illustrating an image sensor of FIG. 9 operating ina second mode;

FIG. 12 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 13 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 14 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 15 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 16 illustrates a circuit diagram of a configuration of a CIS pixelof FIG. 2 ;

FIG. 17 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 18 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 19 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 20 is a diagram illustrating an image sensor of FIG. 19 operatingin a first mode;

FIG. 21 is a diagram illustrating an image sensor of FIG. 19 operatingin a second mode;

FIG. 22 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure;

FIG. 23 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure; and

FIG. 24 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure.

DETAILED DESCRIPTION

Below, embodiments of the disclosure are described in detail and clearlyto such an extent that an artisan of ordinary skill in the art to whichthis disclosure pertains may easily implements the embodiments.

Components that are described in the detailed description with referenceto the terms “unit,” “module,” “˜er or ˜or,” etc. and function blocksillustrated in drawings will be implemented with software, hardware, ora combination thereof. In an embodiment, the software may be a machinecode, firmware, an embedded code, and application software. For example,the hardware may include an electrical circuit, an electronic circuit, aprocessor, a computer, an integrated circuit, integrated circuit cores,a pressure sensor, an inertial sensor, a microelectromechanical system(MEMS), a passive element, or a combination thereof. In addition, unlessotherwise indicated in the present specification, the expression “afirst component is connected to a second component” includes theconfiguration in which two components are indirectly connected with athird component interposed therebetween.

FIG. 1 illustrates an image sensor 1000 according to an embodiment ofthe disclosure. The image sensor 1000 includes an image signal processor1100, a complementary metal-oxide semiconductor (CMOS) image sensor1200, and a dynamic vision sensor (DVS) 1300.

The image signal processor 1100 may process signals output from the CMOSimage sensor 1200 and/or the dynamic vision sensor 1300 and may generateand output an image IMG. In an embodiment, the image signal processor1100 may process frame-based image data received from the CMOS imagesensor 1200 and may generate the image IMG based on the frame-basedimage data. Alternatively, the image signal processor 1100 may processpacket-based or frame-based image data received from the dynamic visionsensor 1300 and may generate the image IMG based on the packet-based orthe frame-based image data.

The image signal processor 1100 may perform various processing on theimage data received from the CMOS image sensor 1200. For example, theimage signal processor 1100 may perform various processing such as colorinterpolation, color correction, auto white balance, gamma correction,color saturation correction, formatting, bad pixel correction, and huecorrection.

The image signal processor 1100 may perform various processing on theimage data received from the dynamic vision sensor 1300. For example,the image signal processor 1100 may correct (or calibrate) a timestampvalue of a noise pixel, a hot pixel, or a dead pixel by using a temporalcorrelation between timestamp values of adjacent pixels of the dynamicvision sensor 1300.

The CMOS image sensor 1200 includes a plurality of CMOS image sensor(CIS) pixels, each CIS pixel among the plurality of CIS pixels includinga photoelectric conversion device (PSD). In contrast, each DVS pixelamong the plurality of DVS pixels of the dynamic vision sensor 1300 doesnot include a photoelectric conversion device. Instead, the dynamicvision sensor 1300 may utilize the photoelectric conversion device PSDof the CMOS image sensor 1200. That is, the CMOS image sensor 1200 andthe dynamic vision sensor 1300 may share the photoelectric conversiondevice PSD.

In an embodiment, when the CMOS image sensor 1200 is operating togenerate the frame-based image data, a path electrically connecting thephotoelectric conversion device PSD and the DVS 1300 may be blocked,disconnected, or otherwise inaccessible to the DVS 1300. In contrast,when the CMOS image sensor 1200 is not operating to generate theframe-based image data, the photoelectric conversion device PSD and theDVS 1300 may be electrically connected. Thereby, when the CMOS imagesensor 1200 is not operating to generate the frame-based image data andis not utilizing the photoelectric conversion device PSD, the DVS 1300may instead utilize the photoelectric conversion device PSD forgenerating the packet-based or the frame-based image data. In anembodiment, the image signal processor 1100 may control an operatingmode of the image sensor 1000. For example, the image signal processor1100 may generate at least one control signal for changing an operatingmode to control switching between various operating modes. Theconfiguration that the CMOS image sensor 1200 and the dynamic visionsensor 1300 share a photoelectric conversion device may reduce the sizeand manufacturing costs of the image sensor 1000. A detailedconfiguration will be more fully described below.

Herein, a CIS pixel of the CMOS image sensor 1200 and a DVS pixel of theDVS 1300 sharing a photoelectric conversion device will be described,but the such concept may be applied to different types and combinationsof sensors and pixels other than a CMOS sensor and pixel and a DVSsensor and pixel. For example, the concept may be applied to acombination of a charge coupled device (CCD)-type pixel and a CIS pixel.Also, the concept may be applied to a combination of a CCD-type pixeland a DVS pixel. In addition, the concept may be applied to an imagesensor including a CCD-type pixel, a CIS pixel, and a DVS pixel. Thetypes of sensors and pixels, and combinations thereof, are not limitedto the above described types and combinations.

FIG. 2 illustrates a configuration of the CMOS image sensor 1200 of FIG.1 .

The CMOS image sensor 1200 is configured to generate image data of anobject 10 incident through a lens 1201. The CMOS image sensor 1200includes a CIS pixel array 1210, a row decoder 1220, a correlated-doublesampler (CDS) 1230, an analog-to-digital converter (ADC) 1240, an outputbuffer 1250, a timing controller 1260, and a ramp generator 1270.

The CIS pixel array 1210 may include a plurality of CIS pixels (PX) 1211arranged in rows and columns. In an embodiment, and each CIS pixel amongthe plurality of CIS pixels 1211 may have a three transistor (3TR) pixelstructure in which a pixel is implemented with three transistors, a fourtransistor (4TR) pixel structure in which a pixel is implemented withfour transistors, or a five transistor (5TR) pixel structure in which apixel is implemented with five transistors. Alternatively, at least twoCIS pixels of the plurality of CIS pixels constituting the CIS pixelarray 1210 may share the same floating diffusion region FD (or afloating diffusion node). However, the structure of the CIS pixel is notlimited to the above configuration.

The row decoder 1220 may select and drive a row of the CIS pixel array1210. In an embodiment, the row decoder 1220 decodes a row addressand/or control signals that are output from the timing controller 1260and generates control signals for selecting and driving the row of theCIS pixel array 1210 indicated by the row address and/or controlsignals. For example, the row decoder 1220 may generate a select signalVSEL, a reset signal VRST, and a transfer signal VTG and may transmitthe generated signals VSEL, VRST, and VTG to pixels corresponding to theselected row.

The correlated-double sampler 1230 may sequentially sample and hold aset of a reference signal and an image signal provided from the CISpixel array 1210 through column lines CL1 to CLn. In other words, thecorrelated-double sampler 1230 may sample and hold levels of thereference signal and the image signal corresponding to each of columns.The correlated-double sampler 1230 may provide the set of the referencesignal and the image signal, which are sampled with regard to eachcolumn, to the analog-to-digital converter 1240 under control of thetiming controller 1260.

The analog-to-digital converter 1240 may convert a correlated-doublesampling signal of each column output from the correlated-double sampler1230 into a digital signal. In an embodiment, the analog-to-digitalconverter 1240 may compare the correlated-double sampling signal and aramp signal output from the ramp generator 1270 and may generate adigital signal corresponding to a comparison result.

The output buffer 1250 may temporarily store the digital signal providedfrom the analog-to-digital converter 1240.

The timing controller 1260 may control an operation of at least one ofthe CIS pixel array 1210, the row decoder 1220, the correlated-doublesampler 1230, the analog-to-digital converter 1240, the output buffer1250, and the ramp generator 1270.

The ramp generator 1270 may generate the ramp signal and may provide theramp signal to the analog-to-digital converter 1240.

For example, at least a part of the row decoder 1220, thecorrelated-double sampler 1230, the analog-to-digital converter 1240,the output buffer 1250, the timing controller 1260, and the rampgenerator 1270 may be called a “CIS peripheral circuit.”

FIG. 3 illustrates an exemplary configuration of the CIS pixel 1211 ofFIG. 2 . In an embodiment, the CIS pixel 1211 may have a four transistor(4TR) structure including four transistors. The CIS pixel 1211 mayinclude a photoelectric conversion device PSD, a transfer transistor TG,a reset transistor RT, a drive transistor DT, and a select transistorST.

The photoelectric conversion device PSD may generate photoelectrons(hereinafter referred to as a “charge”) in response to an incidentlight. That is, the photoelectric conversion device PSD may convert alight signal to an electrical signal to generate a photocurrent IP. Forexample, the photoelectric conversion device PSD may include aphotodiode, a photo transistor, a pinned photodiode, or any othersimilar device.

The transfer transistor TG may transfer charges generated by thephotoelectric conversion device PSD to the floating diffusion region FD.For example, a source end of the transfer transistor TG may be connectedto the photoelectric conversion device PSD, and a drain end of thetransfer transistor TG may be connected to the floating diffusion regionFD. The transfer transistor TG may be turned on or turned off inresponse to the transfer signal VTG received from the row decoder 1220(refer to FIG. 2 ) at the gate of the transfer transistor TG.

The floating diffusion region FD may have a function to detect chargescorresponding to the amount of incident light. During a time when thetransfer signal VTG is activated, charges provided from thephotoelectric conversion device PSD may be accumulated in the floatingdiffusion region FD. The floating diffusion region FD may be connectedwith a gate terminal of the drive transistor DT that operates as asource follower amplifier. The floating diffusion region FD may be resetto a power supply voltage VDD that is provided when the reset transistorRT is turned on.

The reset transistor RT may be reset by the reset signal VRST and mayprovide the power supply voltage VDD to the floating diffusion regionFD. In this case, the charges accumulated in the floating diffusionregion FD may move to a terminal for the power supply voltage VDD, and avoltage of the floating diffusion region FD may be reset. Even thoughthe description is given as the power supply voltage VDD is used as avoltage to be applied to the floating diffusion region FD, variouslevels of voltages (i.e., a reset voltage) may be used to reset thefloating diffusion region FD.

The drive transistor DT may operate as a source follower amplifier. Thedrive transistor DT may amplify a change in an electrical potential ofthe floating diffusion region FD and may output an output voltage VOUTcorresponding to an amplification result through the first column lineCL1. An embodiment is illustrated in FIG. 3 as the CIS pixel 1211 isconnected to the first column line CL1.

The select transistor ST may be driven by the select signal VSEL and mayselect a pixel to be read in the unit of a row. When the selecttransistor ST is turned on, a potential of the floating diffusion regionFD may be amplified through the drive transistor DT and may betransferred to a drain electrode of the select transistor ST.

In an embodiment, the drive transistor DT and the select transistor STmay be called a “readout circuit.” That is, the readout circuit maygenerate the output voltage VOUT corresponding to charges accumulated inthe floating diffusion region FD.

FIG. 4 illustrates an exemplary configuration of the dynamic visionsensor 1300 of FIG. 1 .

The dynamic vision sensor 1300 may include a DVS pixel array 1310, acolumn address event representation (AER) circuit 1320, a row AERcircuit 1330, and an output buffer 1340. The dynamic vision sensor 1300may detect an event when an intensity of light incident on a DVS pixelchanges, may determine a type of the detected event (i.e., whether thedetected event is an event that the intensity of light increases or anevent that the intensity of light decreases), and may output a valuecorresponding to the event. For example, the event may mainly occur inan outline of a moving object. Unlike the CMOS image sensor 1200 (referto FIG. 1 ), the dynamic vision sensor 1300 may output only a valuecorresponding to a light, the intensity of which changes, thus markedlyreducing the amount of data to be processed by the dynamic vision sensor1300 and/or the image signal processor 1100 (refer to FIG. 1 ).

The DVS pixel array 1310 may include a plurality of DVS pixels arrangedalong a plurality of rows and a plurality of columns in the form of amatrix. A DVS pixel detecting an event, from among the plurality of DVSpixels of the DVS pixel array 1310, may output a signal (i.e., a columnrequest) CR indicating that the event that the intensity of lightincreases or decreases occurs, to the column AER circuit 1320.

The column AER circuit 1320 may output an acknowledge signal ACK to theDVS pixel in response to the column request CR received from the DVSpixel detecting the event. The DVS pixel that receives the acknowledgesignal ACK may output polarity information PoI of the event to the rowAER circuit 1330. The column AER circuit 1320 may generate a columnaddress C_ADDR of the DVS pixel detecting the event, based on the columnrequest CR received from the pixel detecting the event.

The row AER circuit 1330 may receive the polarity information PoI fromthe DVS pixel detecting the event. The row AER circuit 1330 may generatea timestamp including information about a time when the event occurs,based on the polarity information PoI. In an embodiment, the timestampmay be generated by a time stamper 1332 provided in the row AER circuit1330. For example, the time stamper 1332 may be implemented by using aperiod of time generated in units of several microseconds to tensmicroseconds. The row AER circuit 1330 may output a reset signal RST tothe DVS pixel detecting the event, in response to the polarityinformation PoI. The DVS pixel detecting the event may be reset by thereset signal RST. In addition, the row AER circuit 1330 may generate arow address R_ADDR of the DVS pixel detecting the event.

The row AER circuit 1330 may control a period when the reset signal RSTis generated. For example, to prevent a workload from increasing due tooccurrence of a large quantity of events, the row AER circuit 1330 maycontrol a period when the reset signal RST is generated, such that anevent does not occur during a specific period. That is, the row AERcircuit 1330 may control a refractory period of occurrence of the event.

The output buffer 1340 may generate a packet based on the timestamp, thecolumn address C_ADDR, the row address R_ADDR, and the polarityinformation PoI. The output buffer 1340 may add a header indicating astart of a packet at the front of the packet and a tail indicating anend of the packet at the rear of the packet.

For example, at least a part of the column AER circuit 1320, the row AERcircuit 1330, and the output buffer 1340 may be called a “DVS peripheralcircuit.”

FIG. 5 illustrates a circuit diagram of a configuration of a DVS pixelof a DVS pixel array of FIG. 4 . The DVS pixel 1311 may include aphotoreceptor 1313 and a DVS pixel back-end circuit 1315.

The photoreceptor 1313 may include a logarithmic amplifier LA and afeedback transistor FB. However, unlike a general DVS pixel, thephotoreceptor 1313 may not include the photoelectric conversion devicePSD. The photoelectric conversion device PSD illustrated in FIG. 5 maybe a component of the CIS pixel 1211 (refer to FIG. 3 ). The logarithmicamplifier LA amplifies a voltage corresponding to the photocurrent IPthat is generated by the photoelectric conversion device PSD of the DVSpixel 600. The logarithmic amplifier LA may output a log voltage VLOG ofa log scale. The feedback transistor FB may separate the photoreceptor1315 from a differentiator 1316 described below with respect to FIG. 6 .The DVS pixel back-end circuit 1315 may perform various processing onthe log voltage VLOG. In an embodiment, the DVS pixel back-end circuit1315 may amplify the log voltage VLOG, compare the amplified voltage anda reference voltage to determine whether a light incident on thephotoelectric conversion device PSD is a light, the intensity of whichincreases or decreases, and output an event signal (i.e., an on-event oroff-event) corresponding to a result of the determination. After the DVSpixel back-end circuit 1315 outputs the on-event or the off-event, theDVS pixel back-end circuit 1315 may be reset by the reset signal RST.

FIG. 6 illustrates a configuration of a DVS pixel back-end circuit ofFIG. 5 . The DVS pixel back-end circuit 1315 may include thedifferentiator 1316, a comparator 1317, and a readout circuit 1318.

The differentiator 1316 may amplify the voltage VLOG to generate avoltage VDIFF. For example, the differentiator 1316 may includecapacitors C1 and C2, a differential amplifier DA, and a switch SW, andthe switch SW may operate in response to the reset signal RST. Forexample, the capacitors C1 and C2 may store electrical energy generatedby at least one photoelectric conversion device PSD. For example,capacitances of the capacitor C1 and C2 may be appropriately selected inconsideration of the shortest time (e.g., a refractory period) betweentwo events that are able to occur continuously at one pixel. When theswitch SW is closed by the reset signal RST, a pixel may be initialized(or reset). The reset signal RST may be received from the row AERcircuit 1330 (refer to FIG. 3 ).

The comparator 1317 may compare a level of the output voltage VDIFF ofthe differential amplifier DA and a level of a reference voltage Vrefand may determine whether an event detected by a pixel is an on-event oran off-event. When the event that the intensity of light increases isdetected, the comparator 1317 may output a signal ON indicating that thedetected event is the on-event; when the event that the intensity oflight decreases is detected, the comparator 1317 may output a signal OFFindicating that the detected event is the off-event.

The readout circuit 1318 may output information about the event thatoccurs at the pixel. The information about the event output from thereadout circuit 1318 may include information (e.g., a bit) indicatingwhether the event that occurs is an on-event or an off-event. Theinformation indicating the event output from the readout circuit 1318may be called the “polarity information PoI” (refer to FIG. 4 ). Thepolarity information PoI may be provided to the row AER circuit 1330(refer to FIG. 4 ).

Meanwhile, a configuration of a pixel illustrated in the embodiment ofFIGS. 5 and 6 is exemplary, and the event detection may be applied tovarious configurations of DVS pixels configured to determine a type ofan event based on a result of detecting the intensity of light.

FIG. 7 illustrates CIS pixels and a DVS pixel sharing the photoelectricconversion device PSD, according to an embodiment of the disclosure.

In an embodiment, in a plan view (i.e., pixels are viewed in a Z-axisdirection), four CIS pixels may correspond to one DVS pixel. The reasonis that the size of the DVS pixel is larger than the size of the CISpixel. However, the number of CIS pixels corresponding to one DVS pixelmay vary depending on the sizes of the respective pixels, and is notlimited to the ratio of FIG. 7 .

The photoelectric conversion device PSD of each CIS pixel 1211 may beconnected to the DVS pixel 1311 through an interconnector IC. In anembodiment, when the image sensor 1000 (refer to FIG. 1 ) operates in aDVS mode, the DVS pixel 1311 and only the photoelectric conversiondevice PSD of components of the CIS pixel 1211 may operate. Chargesgenerated by the photoelectric conversion device PSD are transferred tothe DVS pixel 1311 through the interconnector IC. In an embodiment, theinterconnector IC may mean various configurations for electricallyconnecting the CIS pixel 1211 and the DVS pixel 1311. For example, theinterconnector IC may include at least one of an electrical wiring, awire, a solder ball, a bump, and a through silicon via (TSV).

FIG. 8 illustrates a cross-sectional view of an image sensor accordingto an embodiment of the disclosure. The case where the image sensor 1000operates in the DVS mode will be described with reference to FIGS. 3 and5 together.

The image sensor 1000 includes the CIS pixel array 1210 including theCIS pixel 1211 and the DVS pixel array 1310 including the DVS pixel1311. The lenses 1201 may be disposed on the CIS pixel array 1210. TheCIS pixel array 1210 and the DVS pixel array 1310 may be formed ondifferent substrates, respectively.

In an embodiment, a first substrate including the CIS pixel array 1210and a second substrate including the DVS pixel array 1310 may beelectrically connected through solder balls 5 in a flip-chip manner.Alternatively, the first substrate including the CIS pixel array 1210and the second substrate including the DVS pixel array 1310 may beelectrically connected through wires. Alternatively, the first substrateincluding the CIS pixel array 1210 and the second substrate includingthe DVS pixel array 1310 may be electrically connected through TSVs.Alternatively, the first substrate including the CIS pixel array 1210and the second substrate including the DVS pixel array 1310 may beelectrically connected through Cu-to-Cu bonding. However, the abovecouplings are exemplary, and the electrical connection is not limited tothe above couplings.

The CIS pixel 1211 includes the photoelectric conversion device PSD thatincludes a first impurity-injected region 2 and a secondimpurity-injected region 3. The first impurity-injected region 2 and thesecond impurity-injected region 3 may be doped with differentimpurities. In an embodiment, the first impurity-injected region 2 maybe doped with p-type impurities, and the second impurity-injected region3 may be doped with n-type impurities. When a light is incident on thephotoelectric conversion device PSD through the lens 1201, electron-holepairs EHPs corresponding to the intensity of absorbed light aregenerated.

The CIS pixel 1211 includes the transfer transistor TG and the floatingdiffusion region FD, for example as described above regarding FIG. 3 .The CIS pixel 1211 may further include the reset transistor RT, thedrive transistor DT, and the select transistor ST, for example as alsodescribed above regarding FIG. 3 . When the transfer transistor TG isturned on in response to the transfer signal VTG applied to a gateelectrode of the transfer transistor TG, charges that are generated inthe first impurity-injected region 2 and the second impurity-injectedregion 3 may move to the floating diffusion region FD. The charges ofthe floating diffusion region FD are transferred to the DVS pixel 1311through internal wires 4, the solder ball 5, and internal wires 6.

The DVS pixel 1311 may include the photoreceptor 1313 and the DVS pixelback-end circuit 1315. In an embodiment, one DVS pixel 1311 maydetermine whether a detected event is an event that the intensity oflight decreases or an event that the intensity of light increases, basedon the charges received from a plurality of photoelectric conversiondevices PSD. Information about the determined event may be output as asignal (e.g., to the image signal processor 1100 of FIG. 1 , the CISperipheral circuit, or the DVS peripheral circuit) through internalwires 7.

Meanwhile, an example is illustrated in FIG. 8 as the CIS pixel array1210 and the DVS pixel array 1310 are directly electrically connected asan upper layer and a lower layer, but the configuration is not limitedthereto. For example, at least one of the image signal processor 1100,the CIS peripheral circuit, and the DVS peripheral circuit may beinterposed between the CIS pixel array 1210 and the DVS pixel array1310. However, in any case, components (i.e., internal wires such as theinternal wires 4, 5, and 6) for transferring charges of the floatingdiffusion region FD to the DVS pixel 1311 may be provided as in theconfiguration of FIG. 8 .

As illustrated in FIG. 8 , the size of the photoelectric conversiondevice PSD implemented with the first impurity-injected region 2 and thesecond impurity-injected region 3 is considerable, thus causing anincrease in a chip size. However, according to an embodiment of thedisclosure, the DVS pixel 1311 shares photoelectric conversion devicesof the plurality of CIS pixels 1211. Therefore, because the DVS pixel1311 does not implement an additional photoelectric conversion device,the size of an image sensor may be reduced, and manufacturing costs maydecrease.

FIG. 9 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure. The image sensor 1000 includes the CISpixels 1211 and the DVS pixels 1311. In FIG. 9 , four CIS pixels 1211are connected in common to one DVS pixel 1311. However, as discussedabove, a ratio of connections between CIS pixels and a DVS pixel may bedifferently provided according to sizes thereof.

The CIS pixel 1211 is configured to output the output voltage VOUTcorresponding to charges accumulated in the floating diffusion regionFD. The configuration and operation of the CIS pixel 1211 described withreference to FIG. 3 . However, unlike FIG. 3 , the floating diffusionregion FD of the CIS pixel 1211 may be connected to the DVS pixel 1311through the reset transistor RT. In detail, the floating diffusionregion FD may be connected to a component(s) (e.g., SW1 and/or SW2) forchanging an operating mode of the image sensor 1000 through the resettransistor RT. That is, depending on an operating mode corresponding tothe open or closed states of switches SW1 and SW2, the CIS pixel 1211may be selectively connected to the power supply voltage VDD or thefeedback transistor FB.

The DVS pixel 1311 is configured to determine whether a detected eventis an on-event or an off-event, through charges generated by thephotoelectric conversion device PSD of the CIS pixel 1211. Theconfiguration and operation of the DVS pixel 1311 are described withreference to FIG. 5 . However, unlike the DVS pixel 1311 illustrated inFIGS. 5 and 6 , the DVS pixel 1311 may further include components (e.g.,a first switch SW1 and a second switch SW2) for changing an operatingmode of the image sensor 1000. The first and second switches SW1 and SW2may be controlled by a switch control signal SWC that is generated bythe image signal processor 1100 or the row AER circuit 1330 (refer toFIG. 4 ).

In an embodiment, the first and second switches SW1 and SW2 may not beclosed or opened at the same time within the same period. For example,in the case that the first switch SW1 is implemented with an NMOStransistor, the second switch SW2 may be implemented with a PMOStransistor (or vice versa). In this case, the first and second switchesSW1 and SW2 may be controlled by one switch control signal SWC.

In an embodiment, the first and second switches SW1 and SW2 may beimplemented with switches of the same type. For example, each of thefirst and second switches SW1 and SW2 may be implemented with an NMOStransistor. In this case, a component (e.g., an inverter) for invertingthe switch control signal SWC may be further provided such that thefirst and second switches SW1 and SW2 are not closed or opened at thesame time within the same period. For example, the switch control signalSWC may be applied to the first switch SW1, and an inverted switchcontrol signal SWC may be applied to the second switch SW2.

In an embodiment, the first and second switches SW1 and SW2 may beimplemented with switches of the same type. For example, control signalsfor controlling the first and second switches SW1 and SW2 may be appliedto the first and second switches SW1 and SW2, respectively.

Meanwhile, the first and second switches SW1 and SW2 are exemplary. Thatis, in other embodiments, there may be adopted various components thatselectively connect the CIS pixels 1211 to the power supply voltage VDDor the feedback transistor FB. In other embodiments, the first andsecond switches SW1 and SW2 may be provided external to the DVS pixel1311 or may be provided within the CIS pixel 1211. That is, theconfiguration and layout of the first and second switches SW1 and SW2illustrated in FIG. 9 are not intend to limit the configuration. Theconfiguration and operation of the first and second switches SW1 and SW2described above may be applied to embodiments described below.

FIG. 10 is a diagram illustrating an image sensor of FIG. 9 operating ina first mode.

In the first mode, the image sensor 1000 may operate in a CIS mode. Thefirst switch SW1 is closed by the switch control signal SWC, and thesecond switch SW2 is opened by the switch control signal SWC. In thiscase, the power supply voltage VDD is applied to a drain electrode ofthe reset transistor RT through the interconnector IC. In a period whenthe CIS pixel 1211 is reset, when the reset transistor RT is turned onby the reset signal VRST, the floating diffusion region FD may be resetto the power supply voltage VDD. Instead, in the first mode, theremaining components of the DVS pixel 1311 other than the first andsecond switches SW1 and SW2 do not operate.

FIG. 11 is a diagram illustrating an image sensor of FIG. 9 operating ina second mode.

In the second mode, the image sensor 1000 may operate in the DVS mode.The first switch SW1 is opened by the switch control signal SWC, and thesecond switch SW2 is closed by the switch control signal SWC. When thetransfer transistor TG is turned on, charges generated by thephotoelectric conversion device PSD move to the floating diffusionregion FD. When the reset transistor RT is turned on by the reset signalVRST, the charges accumulated in the floating diffusion region FD areinput to the logarithmic amplifier LA. That is, in the second mode, theremaining components of the CIS pixel 1211 other than the photoelectricconversion device PSD, the transfer transistor TG, and the resettransistor RT do not operate. As the photocurrent IP is generated by themovement of the charges, the DVS pixel 1311 may operate.

FIG. 12 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure.

A configuration and an operation of the image sensor 1000 are similar tothose described with reference to FIGS. 9 to 11 . However, unlike theembodiments of FIGS. 9 to 11 , the CIS pixel 1211 may further include aswitch transistor SWT. The DVS pixel 1311 may include only the firstswitch SW1. In an embodiment, the image signal processor 1100 (refer toFIG. 1 ) or the row decoder 1220 (refer to FIG. 2 ) may generate a DVSenable signal EN_DVS for controlling the switch transistor SWT.

In the first mode, the image sensor 1000 may operate in the CIS mode.The switch transistor SWT is turned off by the DVS enable signal EN_DVS,and the remaining components of the CIS pixel 1211 operate as in ageneral CIS pixel. The DVS pixel 1311 does not operate.

In the second mode, the image sensor 1000 may operate in the DVS mode.The switch transistor SWT is turned on by the DVS enable signal EN_DVS.The remaining components of the CIS pixel 1211 other than thephotoelectric conversion device PSD and the switch transistor SWT do notoperate. The first switch SW1 is also closed by the switch controlsignal SWC. As charges generated by the photoelectric conversion devicePSD move, the photocurrent IP is generated. As the photocurrent IP isinput to the logarithmic amplifier LA, the DVS pixel 1311 may operate.

FIG. 13 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure. The embodiment of FIG. 13 is similar tothe embodiment of FIG. 12 in that the DVS pixel 1311 includes the firstswitch SW1 and the CIS pixel 1211 includes the switch transistor SWT.However, the switch transistor SWT may be connected to the floatingdiffusion region FD.

In the first mode, the image sensor 1000 may operate in the CIS mode.The switch transistor SWT is turned off by the DVS enable signal EN_DVS,and the remaining components of the CIS pixel 1211 operate as in ageneral CIS pixel. The DVS pixel 1311 does not operate. That is, in thefirst mode, the operation of the CIS pixel 1211 is the same as that ofthe embodiment of FIG. 12 .

In the second mode, the image sensor 1000 may operate in the DVS mode.The switch transistor SWT is turned on by the DVS enable signal EN_DVS.The remaining components of the CIS pixel 1211 other than thephotoelectric conversion device PSD, the transfer transistor TG, and theswitch transistor SWT do not operate. That is, the embodiment of FIG. 13is different from the embodiment of FIG. 12 in that the transfertransistor TG operates. The first switch SW1 is also turned on by theswitch control signal SWC. As the photocurrent IP is generated by themovement of charges generated by the photoelectric conversion devicePSD, the DVS pixel 1311 may operate.

FIG. 14 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure.

The CIS pixel 1211 may include the photoelectric conversion device PSD,the reset transistor RT, the drive transistor DT, and the selecttransistor ST. That is, unlike the above embodiments, the CIS pixel 1211includes three transistors and does not include a transfer transistor(e.g., TG of FIG. 9 ).

In the first mode, the image sensor 1000 may operate in the CIS mode.The first switch SW1 is closed by the switch control signal SWC, and thesecond switch SW2 is opened by the switch control signal SWC. Chargesgenerated by the photoelectric conversion device PSD may be directlytransferred to the floating diffusion region FD. A process in which theoutput voltage VOUT corresponding to charges of the floating diffusionregion FD is output when the select transistor ST is turned on by theselect signal VSEL is similar to that described with reference to theembodiment of FIG. 3 .

In the second mode, the image sensor 1000 may operate in the DVS mode.The first switch SW1 is opened by the switch control signal SWC, and thesecond switch SW2 is closed by the switch control signal SWC. The resettransistor RT is turned on by the reset signal VRST. As the photocurrentIP is generated by the movement of charges generated by thephotoelectric conversion device PSD, the DVS pixel 1311 may operate.

FIG. 15 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure.

The CIS pixel 1211 may include the photoelectric conversion device PSD,the transfer transistor TG, the reset transistor RT, the drivetransistor DT, a first select transistor ST1, and a second selecttransistor ST2. That is, the CIS pixel 1211 may have a five transistor(5TR) structure. The second select transistor ST2 is turned on by theselect signal VSEL and transfers the transfer signal VTG to a gateelectrode of the transfer transistor TG. Gate electrodes of the firstand second select transistors ST1 and ST2 may be interconnected toreceive the select signal VSEL.

In the first mode, the image sensor 1000 may operate in the CIS mode.The first switch SW1 is closed by the switch control signal SWC, and thesecond switch SW2 is opened by the switch control signal SWC. Totransfer charges generated by the photoelectric conversion device PSD tothe floating diffusion region FD, the select signal VSEL may be appliedto the first and second select transistors ST1 and ST2. When the secondselect transistor ST2 is turned on, the transfer signal VTG is appliedto the transfer transistor TG, and the transfer transistor TG is turnedon. In this case, the charges are transferred to the floating diffusionregion FD. The operation of the CIS pixel 1211 is similar to thatdescribed with reference to the embodiment of FIGS. 9 to 11 except thatthe second select transistor ST2 is added.

In the second mode, the image sensor 1000 may operate in the DVS mode.The second select transistor ST2 is turned on by the select signal VSEL.As the transfer signal VTG is applied to the gate electrode of thetransfer transistor TG, the transfer transistor TG is turned on. Thereset transistor RT is turned on by the reset signal VRST. The firstswitch SW1 is opened by the switch control signal SWC, and the secondswitch SW2 is closed by the switch control signal SWC. As thephotocurrent IP is generated by the movement of charges generated by thephotoelectric conversion device PSD, the DVS pixel 1311 may operatebased on the photocurrent IP.

FIG. 16 illustrates a circuit diagram of a configuration of a CIS pixelof FIG. 2 .

The CIS pixel 1211 may include photoelectric conversion devices PSD1 toPSD4, transfer transistors TG1 to TG4, the reset transistor RT, thedrive transistor DT, and the select transistor ST. The firstphotoelectric conversion device PSD1, the first transfer transistor TG1,the reset transistor RT, the drive transistor DT, and the selecttransistor ST may constitute a first sub-CIS pixel 1211 a. An example isillustrated in FIG. 16 as the first sub-CIS pixel 1211 a surrounds onlythe first photoelectric conversion device PSD1 and the first transfertransistor TG1, but this is for brevity of illustration. As in the abovedescription, the second photoelectric conversion device PSD2, the secondtransfer transistor TG2, the reset transistor RT, the drive transistorDT, and the select transistor ST may constitute a second sub-CIS pixel1211 b. Configurations of a third sub-CIS pixel 1211 c and a fourthsub-CIS pixel 1211 d are the same as the above-described configuration.

The first to fourth sub-CIS pixels 1211 a to 1211 d may share thefloating diffusion region FD. In an embodiment, the first sub-CIS pixel1211 a may include a green filter, the second sub-CIS pixel 1211 b mayinclude a blue filter, the third sub-CIS pixel 1211 c may include a redfilter, and the fourth sub-CIS pixel 1211 d may include a green filter.The red filter may transmit a light in a red wavelength band, the greenfilter may transmit a light in a green wavelength band, and the bluefilter may transmit a light in a blue wavelength band.

In an embodiment, the first to fourth sub-CIS pixels 1211 a to 1211 dmay sequentially operate. For example, in an operation of the firstsub-CIS pixel 1211 a, when the first transfer transistor TG1 is turnedon by a first transfer signal VTG1, charges generated by the firstphotoelectric conversion device PSD1 are transferred to the floatingdiffusion region FD. When the select transistor ST is turned on by theselect signal VSEL, the output voltage VOUT corresponding to the chargesof the floating diffusion region FD is output. When the reset transistorRT is turned on by the reset signal VRST, the floating diffusion regionFD is reset.

After the operation of the first sub-CIS pixel 1211 a, the secondsub-CIS pixel 1211 b may operate to be similar to the first sub-CISpixel 1211 a. The third sub-CIS pixel 1211 c and the fourth sub-CISpixel 1211 d may operate to be similar to the first sub-CIS pixel 1211a.

However, the layout of color filters in a pixel group, the number of CISpixels connected in common to the floating diffusion region FD, aconfiguration of the pixel group, and an operation of the pixel groupare exemplary. The configuration is not limited thereto. For example,the configuration may be applied to CIS image sensors of variousconfigurations in which a plurality of photoelectric conversion devicesshare the floating diffusion region FD.

FIG. 17 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure.

The CIS pixel 1211 illustrated in FIG. 17 is substantially the same asthe CIS pixel 1211 of FIG. 16 . Therefore, components of FIG. 17 may becalled the first, second, third, and fourth sub-CIS pixels 1211 a, 1211b, 1211 c, and 1211 d like the components of FIG. 16 . For example, thefirst photoelectric conversion device PSD1, the first transfertransistor TG1, the reset transistor RT, the drive transistor DT, andthe select transistor ST are called the “first sub-CIS pixel 1211 a.”The second to fourth sub-CIS pixels 1211 b to 1211 d are also similar tothe above description. For clarity of illustration, the referencenumerals 1211 a, 1211 b, 1211 c, and 1211 d illustrated in FIG. 16 areomitted.

In the first mode, the image sensor 1000 may operate in the CIS mode.The first switch SW1 is closed by the switch control signal SWC, and thesecond switch SW2 is opened by the switch control signal SWC. Theoperations of sub-CIS pixels constituting the CIS pixel 1211 in the CISmode are described with reference to FIG. 16 , and thus, redundantdescription is omitted.

In the second mode, the image sensor 1000 may operate in the DVS mode.The transfer transistors TG1 to TG4 are turned on in response to thetransfer signals VTG1 to VTG4 applied to gate electrodes of the transfertransistors TG1 to TG4. The reset transistor RT is turned on by thereset signal VRST. The first switch SW1 is opened by the switch controlsignal SWC, and the second switch SW2 is closed by the switch controlsignal SWC. As the photocurrent IP is generated by the movement ofcharges generated by the photoelectric conversion devices PSD1 to PSD4,the DVS pixel 1311 may operate based on the photocurrent IP.

In an embodiment, only a part of the transfer transistors TG1 to TG4 maybe turned on to adjust the sensitivity (or the intensity) of receivedlight. Unlike the above embodiments, in the embodiment of FIG. 17, 16CIS pixels may be connected to one DVS pixel. Therefore, only a portionof the 16 transfer transistors may be turned on to adjust thesensitivity (or the intensity) of received light or to reduce powerconsumption of the image sensor 1000.

FIG. 18 illustrates an image sensor according to an embodiment of thedisclosure.

The image sensor 1000 includes a plurality of photoelectric conversiondevices PSD, a first transistor T1, a second transistor T2, a logcurrent source ILOG, and the DVS pixel back-end circuit 1315. In anembodiment, FIG. 18 shows only components associated with generating anevent signal from among all components of an image sensor. That is, thecomponents illustrated in FIG. 18 correspond to components operating inthe DVS mode from among the components of the image sensor, and somecomponents of a CIS pixel are not illustrated.

Below, operations of the illustrated components will be described. Thesecond transistor T2 may be turned on by the photocurrent IP generatedby charges of the photoelectric conversion devices PSDs. The firsttransistor T1 may be turned on by the log voltage VLOG that is based onthe log current source ILOG. Here, a magnitude of the log voltage VLOGmay have a value of a log scale. For example, a node from which acurrent of the log current source ILOG is output is called a “logvoltage node.”

In an embodiment, the log current source ILOG may be a component of aDVS pixel. The first and second transistors T1 and T2 and thephotoelectric conversion devices PSD may be components of a CIS pixel.According to the embodiment of FIG. 18 , the DVS pixel may not includeany other components (e.g., the first and second transistors T1 and T2)as well as the photoelectric conversion device PSD. Therefore, the sizeof the general DVS pixel may be further reduced. Below, a structure ofan image sensor in which the DVS pixel shares some components of the CISpixel will be described with reference to FIG. 19 .

FIG. 19 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure. In an embodiment, FIG. 19 shows the imagesensor 1000 for implementing a circuit structure of FIG. 18 . The imagesensor 1000 includes the CIS pixels 1211 and the DVS pixels 1311. Anembodiment is illustrated in FIG. 19 as four CIS pixels 1211 areconnected in common to one DVS pixel 1311.

The CIS pixel 1211 is configured to output the output voltage VOUTcorresponding to charges accumulated in the floating diffusion regionFD. A configuration and an operation of the CIS pixel 1211 aresubstantially the same as those described with reference to FIG. 9 .However, there may be a difference in connection between the CIS pixel1211 and the DVS pixel 1311. In detail, a gate electrode of the resettransistor RT may be connected to a component(s) (e.g., SW1 and/or SW2)for changing an operating mode of the image sensor 1000 through a firstinterconnector IC1. In detail, one end of the drive transistor DT may beconnected to a component(s) (e.g., SW2 and/or switch SW3) for changingthe operating mode of the image sensor 1000 through a secondinterconnector IC2.

The DVS pixel 1311 is configured to determine whether a detected eventis an on-event or an off-event, through charges generated by thephotoelectric conversion device PSD of the CIS pixel 1211. However, theDVS pixel 1311 according to the above embodiments does not include thephotoelectric conversion device PSD; in addition, the DVS pixel 1311according to the embodiment of FIG. 19 does not include transistors(e.g., T1 and T2 of FIG. 18 ). Instead, the DVS pixel 1311 may furtherinclude components (e.g., the first to third switches SW1 to SW3) forchanging the operating mode of the image sensor 1000. The first to thirdswitches SW1 to SW3 may be controlled by that switch control signal SWCthat the image signal processor 1100 or the row AER circuit 1330 (referto FIG. 4 ) generates.

Meanwhile, the image sensor 1000 may include a fourth switch SW4 forselectively providing the power supply voltage VDD that is to be appliedto the drive transistor DT in the CIS mode. For example, the fourthswitch SW4 may be connected to the second interconnector IC2 and mayselectively provide the power supply voltage VDD to the drive transistorDT. For example, the first to fourth switches SW1 to SW4 may be called a“switching circuit.”

FIG. 20 is a diagram illustrating an image sensor of FIG. 19 operatingin a first mode.

In the first mode, the image sensor 1000 may operate in the CIS mode.The first switch SW1 may be closed or opened by the switch controlsignal SWC. In detail, the first switch SW1 may be closed to reset thefloating diffusion region FD. The second and third switches SW2 and SW3are opened. In this case, the fourth switch SW4 may be closed.

FIG. 21 is a diagram illustrating an image sensor of FIG. 19 operatingin a second mode.

In the second mode, the image sensor 1000 may operate in the DVS mode.The first and fourth switches SW1 and SW4 are opened by the switchcontrol signal SWC, and the second and third switches SW2 and SW3 areclosed by the switch control signal SWC. That is, a gate electrode ofthe reset transistor RT and a drain electrode of the drive transistor DTmay be connected to the log voltage node. The transfer transistor TG isturned on by the transfer signal VTG.

A source electrode of the select transistor ST from which the outputvoltage VOUT is output may be grounded. Although not illustrated forclarity of illustration, there may be included a component (e.g., aswitch) for selectively connecting the source electrode of the selecttransistor ST to a ground terminal or a column line (e.g., CL1 of FIG. 3).

Compared the circuit diagram corresponding to a switching state of FIG.21 with the circuit diagram of FIG. 18 , it may be understood that theimage sensor 1000 of FIG. 18 and the image sensor 1000 of FIG. 21 aresimilar. That is, the first transistor T1 and the second transistor T2of FIG. 18 correspond to the reset transistor RT and the drivetransistor DT of FIG. 22 , respectively.

FIG. 22 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure.

The embodiment of FIG. 22 is similar to the embodiments of FIGS. 19 to21 . However, compared with the embodiment of FIGS. 19 to 21 , theembodiment of FIG. 22 may have a difference in the configuration andlayout of the switches SW1 to SW3. In an embodiment, the third switchSW3 may be selectively connected to the power supply voltage VDD or thelog current source ILOG depending on an operating mode. For example, thethird switch SW3 may be connected to the power supply voltage VDD in thefirst mode and may be connected to the log current source ILOG in thesecond mode.

However, a configuration for applying the reset signal VRST to a gateelectrode of the reset transistor RT in the first mode, applying thepower supply voltage VDD to the drive transistor DT, connecting the logcurrent source ILOG to the drive transistor DT and a gate electrode ofthe reset transistor RT in the second mode is not limited thereto. Thatis, various switch configurations for implementing the circuit structureof FIG. 18 may be adopted in addition to the embodiments of FIGS. 19 to22 .

FIG. 23 illustrates an image sensor according to an embodiment of thedisclosure.

The image sensor 1000 includes the plurality of photoelectric conversiondevices PSD, the first transistor T1, the second transistor T2, the logcurrent source ILOG, and the DVS pixel back-end circuit 1315. In anembodiment, FIG. 23 shows only components associated with generating anevent signal from among all components of an image sensor. That is, thecomponents illustrated in FIG. 23 correspond to components operating inthe DVS mode from among the components of the image sensor, and somecomponents of a CIS pixel are not illustrated.

The circuit diagram of FIG. 23 is similar to the circuit diagram of FIG.18 . However, the first transistor T1 may be replaced with a PMOStransistor, and one end of the first transistor T1 is connected to thelog voltage node from which a current of the log voltage VLOG is output.The log current source ILOG may be a component of a DVS pixel, and thefirst and second transistors T1 and T2 and the photoelectric conversiondevices PSD may be components of a CIS pixel. The second transistor T2may be turned on by the photocurrent IP generated by charges that thephotoelectric conversion devices PSD generate. The first transistor T1may be turned on by a separate voltage “V.” The log voltage node mayhave a voltage value of a log scale.

FIG. 24 illustrates a circuit diagram of an image sensor according to anembodiment of the disclosure. In an embodiment, FIG. 24 shows the imagesensor 1000 for implementing a circuit structure of FIG. 23 . The imagesensor 1000 includes the CIS pixels 1211 and the DVS pixels 1311.

The configuration of the CIS pixel 1211 is similar to that of FIG. 19 .However, the reset transistor RT may be implemented with a PMOStransistor. One end of the reset transistor RT may be connected to acomponent(s) (e.g., SW1 and/or SW2) for changing an operating mode ofthe image sensor 1000 through the first interconnector IC1. One end ofthe drive transistor DT may be connected to a component(s) (e.g., SW2and/or SW3) for changing the operating mode of the image sensor 1000through the second interconnector IC2.

The configuration of the DVS pixel 1311 is the same as that of FIG. 19except that the power supply voltage VDD is provided to the CIS pixel1211 through the first switch SW1. Thus, redundant description will beomitted.

In the first mode, the image sensor 1000 may operate in the CIS mode.The first switch SW1 may be closed by the switch control signal SWC in aperiod for resetting the floating diffusion region FD, and the firstswitch SW1 may be opened in the remaining period. The second and thirdswitches SW2 and SW3 are opened. In this case, the fourth switch SW4 maybe closed.

In the second mode, the image sensor 1000 may operate in the DVS mode.The first and fourth switches SW1 and SW4 are opened by the switchcontrol signal SWC, and the second and third switches SW2 and SW3 areclosed by the switch control signal SWC. That is, one end of the resettransistor RT and one end of the drive transistor DT may be connected tothe log voltage node. The transfer transistor TG is turned on by thetransfer signal VTG. The reset transistor RT is turned on by the resetsignal VRST.

According to the above embodiments, a DVS pixel of the disclosure doesnot include a photoelectric conversion device. Instead, the DVS pixeldetermines a type of an event by using a photoelectric conversion devicePSD of a CIS pixel. In addition, in some embodiments, the PSD-free DVSpixel does not include some transistors and uses transistors of the CISpixel. Therefore, the proposed architectures may reduce the size of animage sensor and decrease manufacturing costs.

According to embodiments of the disclosure, a dynamic vision sensor usesa photoelectric conversion device included in a CMOS image sensor.

Therefore, the size of an image sensor may be reduced, and manufacturingcosts may decrease.

While the disclosure has been described with reference to embodimentsthereof, it will be apparent to those of ordinary skill in the art thatvarious changes and modifications may be made thereto without departingfrom the spirit and scope of the disclosure as set forth in thefollowing claims.

What is claimed is:
 1. A sensor comprising: a first substrate comprisinga plurality of photoelectric conversion devices and a floating diffusionregion connected to the plurality of photoelectric conversion devices;and a second substrate configured to receive charges from the pluralityof photoelectric conversion devices, and determine a change in lightintensity incident on the plurality of photoelectric conversion devicesbased on the charges, wherein the first substrate is coupled with thesecond substrate via a plurality of metal-to-metal bondings, and whereinthe plurality of photoelectric conversion devices form a single dynamicvision sensor pixel.
 2. The sensor of claim 1, further comprising aplurality of lens on the plurality of photoelectric conversion devices,wherein the plurality of metal-to-metal bondings are vertically overlapwith the plurality of lens.
 3. The sensor of claim 2, wherein theplurality of photoelectric conversion devices are disposed in a matrixform of N×N, and wherein N is an integer greater than
 1. 4. The sensorof claim 1, wherein the metal-to-metal bondings comprise Cu-to-Cubondings.
 5. The sensor of claim 2, wherein the sensor is configured totransmit an event signal as a packet-based signal.
 6. The sensor ofclaim 2, wherein the sensor is configured to transmit an event signal asa frame-based signal.
 7. The sensor of claim 5, the first substratefurther comprises a plurality of transfer transistors, and wherein eachof the plurality of transfer transistors is connected to a correspondingone of the plurality of photoelectric conversion devices.
 8. The sensorof claim 5, wherein the second substrate comprises a logarithmicamplifier and a feedback transistor configured to determine the changein the light intensity.
 9. The sensor of claim 8, wherein the sensor isconfigured to receive an operating mode signal from an image signalprocessor, and wherein the sensor is configured to output the eventsignal in response to the operating mode signal.
 10. A sensorcomprising: a first substrate comprising a plurality of photoelectricconversion devices configured to generate charges; and a secondsubstrate configured to receive a first plurality of charges and asecond plurality of charges from the first substrate, wherein the firstsubstrate is coupled with the second substrate via a plurality ofmetal-to-metal bondings, and wherein the second substrate comprises alogarithmic amplifier and a feedback transistor configured to determinea change in light intensity, wherein the sensor is configured to outputan image signal about an object based on the first plurality of chargesand an event signal based on the second plurality of charges, andwherein the event signal represents a movement of the object.
 11. Thesensor of claim 10, wherein the sensor is configured to output the eventsignal as a packet-based signal.
 12. The sensor of claim 11, furthercomprising a plurality of lens on the plurality of photoelectricconversion devices, wherein the plurality of metal-to-metal bondings arevertically overlap with the plurality of lens.
 13. The sensor of claim12, wherein the sensor is configured to output the image signal as aframe-based signal.
 14. The sensor of claim 10, wherein themetal-to-metal bondings comprise Cu-to-Cu bonding.
 15. The sensor ofclaim 10, wherein the sensor is configured to receive an operating modesignal from an image signal processor, and wherein the sensor isconfigured to output the event signal or the image signal in response tothe operating mode signal.
 16. The sensor of claim 15, wherein thesecond substrate is configured to receive the first charges via a firstpath and receive the second plurality of charges via a second pathdifferent from the first path in response to the operating mode signal.17. The sensor of claim 16, wherein the sensor is configured to outputthe image signal or the event signal to the image signal processor. 18.A sensor comprising: a first substrate comprising a plurality ofphotoelectric conversion devices; and a second substrate configured toreceive charges from the plurality of photoelectric conversion devices,the second substrate being coupled with the first substrate, wherein thesecond substrate comprises a logarithmic amplifier and a feedbacktransistor configured to determine a change in light intensity, andwherein the sensor is configured to output an event signal related to amovement of an object as a packet-based signal or an image signalrelated to an image of the object as a frame-based signal.
 19. Thesensor of claim 18, further comprising a plurality of lens on theplurality of photoelectric conversion devices, and wherein the firstsubstrate is coupled with the second substrate via a plurality ofmetal-to-metal bondings.
 20. The sensor of claim 19, wherein the sensoris configured to output the event signal or the image signal to a sameimage signal processor.
 21. The sensor of claim 19, wherein themetal-to-metal bondings comprise Cu-to-Cu bondings.
 22. The sensor ofclaim 18, wherein the sensor is configured to selectively output theevent signal or the image signal to the image signal processor.